Aspect Ratio Max.: 47
Layer Count Max.: 100
Pitch Min.: 0.32mm
WAFER TEST (CP)
The probe card is a crucial intermediary tool between the testing machine and the wafer under test. Through the contact between the probes on the probe card and the pads or bumps on the wafer, electrical signals are transmitted to the testing machine to analyze the functions and characteristics, determining the quality of the dies. This electrical measurement method screens out defective products, reducing the number of defective dies entering the subsequent packaging process after dicing, thereby lowering the waste of IC production costs.
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- High temperature, up to 180℃
- High frequency, excellent RF test performance
- High current, up to 2,000 mA (single pin)
- Suitable for pitch 110 ~ 200 um
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- High temperature, up to 180℃
- High frequency, up to 112 Gbps
- High current, up to 2,000 mA (single pin)
- Suitable for pitch 80 ~ 200 um
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- High temperature, up to 180℃
- High frequency, up to 56 Gbps
- High current, up to 2,000 mA (single pin)
- Suitable for pitch 100 ~ 200 um
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- High temperature, up to 180℃
- High current, up to 1,300 mA (single pin)
- Suitable for pitch 45 ~ 100 um
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Probe card circuit board
Probe tip
針頭類型：MEMS
針頭系列：NS、BKS、BR、SS
最大針腳數：50,000
針頭系列：NS、BKS、BR、SS
最大針腳數：50,000
IC substrate
C4 Pad Count Max.: 50,000 pins
C4 Pad Pitch: 50-200um
ST Type: AMLO, TFMLO
C4 Pad Pitch: 50-200um
ST Type: AMLO, TFMLO
Probe card circuit board
Aspect Ratio Max.: 47
Layer Count Max.: 100
Pitch Min.: 0.32mm
Layer Count Max.: 100
Pitch Min.: 0.32mm
Probe tip
針頭類型：MEMS
針頭系列：NS、BKS、BR、SS
最大針腳數：50,000
針頭系列：NS、BKS、BR、SS
最大針腳數：50,000
IC substrate
C4 Pad Count Max.: 50,000 pins
C4 Pad Pitch: 50-200um
ST Type: AMLO, TFMLO
C4 Pad Pitch: 50-200um
ST Type: AMLO, TFMLO
