YesICAn important test interface after packaging, mainly serving as a carrierICAs a carrier, when the wafer undergoes processes such as dicing, die attach, and wire bonding, and is then encapsulated with materials like plastic, ceramic, or metal, yield testing must be performed again.

ICTest boards are mainly used inICPost-packaging yield test(Final Testing, FT)to perform functional testing and sorting, with the purpose of ensuringICwhether attributes such as functionality, speed, reliability, and power consumption are normal. Through testing at this stage, defective functions are eliminated.ICto further ensureICproduct quality, preventing the end product fromICDefects result in scrap,ICTest boards, like wafer test boards, can reduce waste in downstream process costs.