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CHIP PROBING
Confirm that semiconductor components operate within the design specifications and eliminate chips that may have defects during the production process to avoid subsequent packaging.
Final Test (FT)
It is an important test interface after IC packaging, mainly functioning as a carrier for the IC. When the wafer undergoes processes such as dicing, die bonding, and wire bonding, and is then encapsulated with materials like plastic, ceramic, or metal, the yield must be tested again.
CHPTBYAI
From design to after-sales, China Precision Measurement provides a one-stop solution for your testing needs.
Integrating design, manufacturing, assembly, and after-sales service to provide customers with a more convenient contact point and quickly respond to customer needs.
Creating the greatest synergy through mutual support in technology, production capacity, marketing, and service.
6 STEPS
01
R&D
02
DESIGN
03
PCB
04
PCBA
05
ASSEMBLY
06
SERVICE
ABOUT CHPT
About Chunghwa Precision Test Tech. Co., Ltd
Wafer & IC Test Board R&D
CHPT is a rare semiconductor test interface company combining R&D and manufacturing of wafer-level test probes. By collaborating with customers on advanced technologies, it has established a unique All-In-House model, enabling rapid innovation and creating mutual success.
WHY CHPT
- In-house probe production equipment for precise material control
- Custom IC test PCBs and ST
- AI-driven probe card design
- High-performance, reliable, long-lasting probe cards
